IPC invites industry members to submit abstracts and course proposals for the IPCWorksreg; Conference The Impact of Implementing Lead Free Technologyrdquo; to take place September 10-14 in Fort Worth, Texas. John Perry, IPC technical project manager and conference director, notes that even companies who have explored lead free know that research isnrsquo;t enough. Implementation is taking place now. We have focused this conference on the real-world implications of integrating lead free into the manufacturing process. Presentations from environmental managers and technologists are sought on all relevant subjects, including: bull; Processing Implications in a Lead Free Environment o Component Issues (Temperature and Moisture Sensitivity) o Printed Board Solderability o Via Fill Issues o Vapor Phase Soldering o Solder Joint Reliability o Planar Microvoids o Tin Whiskers bull; Impact of Lead Free on Stencil Design bull; Implications for Equipment: Acquisitions, Modifications, etc. bull; Material Impact of Lead Free Implementation bull; Implication of Using Applicable Laminates bull; Implication of Using Applicable Soldering Fluxes bull; Implementing Proper Material Declaration bull; User Experiences with Lead Free bull; Environmental Compliance (Including RoHS, WEEE EUP) Those interested are asked to provide a 200-300 word abstract that summarizes original work, focusing on technology rather than a companyrsquo;s product. Proposals are also being solicited from individuals interested in teaching full-day tutorials or half-day workshops to a class of up to 30 persons. The deadline for abstract submission is June 15, 2006. Once abstracts are accepted, the deadline for presentation and/or paper submission is August 15, 2006. To submit an abstract, send an e-mail to ToyaRichardson@ipc.org. To submit a course proposal, send an e-mail to AlexandraCurtis@ipc.org. For more information, call 847-597-2825.
